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JUKI SMT LX-8 is a multifunctional SMT machine that combines high productivity, versatility and high precision, and is particularly suitable for high-density and high-precision placement needs.
Main features High productivity: LX-8 is equipped with a high-grade ultra-high-speed placement head with a maximum speed of 105,000CPH (in the case of a planetary P20S placement head). In addition, the number of feeders installed on LX-8 can reach up to 160, which greatly shortens the replacement time and simplifies and improves production preparation. Versatility: LX-8 supports a variety of placement heads, including planetary P20S placement heads and Takumi HEAD. The planetary P20S placement head is suitable for stable suction of extremely small parts, while the Takumi HEAD uses lasers to achieve high-precision recognition and is suitable for parts of various sizes. In addition, LX-8 can flexibly replace placement heads without changing the production line layout, and flexibly respond to various production needs. High Precision: LX-8 adopts advanced process technology to improve the accuracy and stability of the product. High-precision recognition is achieved through VCS (visual control system), which greatly shortens the recognition time and improves production efficiency.
User-Friendly: LX-8 is equipped with a new operating touch screen, which has a smartphone operation feel, a user-friendly interface, and is easy to operate.
Wide Adaptability: LX-8 can handle parts of various sizes, from 0201 to 65mm×90mm parts can be mounted, and the maximum part height is 25mm. In addition, LX-8 is also suitable for high-density and high-precision mounting needs such as LED lights.
Paramètres techniques
Maximum speed: 105,000CPH (Planet P20S placement head)
Number of feeders installed: Up to 160
Part size range: 0201 to 65mm×90mm
Maximum part height: 25mm
Applicable part types: Including 0201, BGA, QFP, SOP, etc.
Scénarios d'application
JUKI LX-8 placement machine is widely used in the electronics manufacturing industry, especially for scenarios requiring high-density and high-precision placement, such as the production of smartphones, tablets, automotive electronics and other products. Its efficient production capacity and wide applicability make it an indispensable equipment in modern electronics manufacturing
