Amplituden-Hochleistungslaser Satsuma X

Amplitude Satsuma X is a high-power ultrafast thin-disk laser launched by Amplitude of France. It uses revolutionary thin-disk amplifier technology to achieve kilowatt-level average power output while maintaining femtosecond pulse accuracy, redefining the power boundary of industrial ultrafast processing.

2. Breakthrough working principle

1. Thin-slice amplifier architecture

Gain medium: Yb:YAG crystal thin slice (thickness <200μm)

Surface area/volume ratio is 100 times that of traditional rod lasers

Supports multi-pass pumping (16 energy extractions)

Thermal management advantages:

Thermal gradient <0.1°C/mm (traditional rod lasers >5°C/mm)

Theoretical thermal lens effect approaches zero

2. Multi-stage amplification system

Seed source: fiber oscillator (pulse width <300fs)

Pre-amplification stage: fiber CPA system (pulse stretching to 2ns)

Main amplifier stage: thin-slice multi-pass amplifier (single pulse energy >50mJ)

Compressor: grating pair compresses back femtosecond pulses

3. Real-time control technology

Adaptive optical system:

Deformable mirror corrects wavefront distortion (accuracy λ/10)

Real-time pulse diagnosis (FROG technology integration)

Intelligent power management:

Automatically adjust pulse train parameters according to material reflectivity

Power fluctuation <±0.8% (8 hours of continuous operation)

III. Industry-leading advantages

1. Power-precision balance

Parameters Satsuma X HP3 Traditional disk laser

Average power 1kW 500W

Single pulse energy 50mJ 20mJ

Processing speed of aluminum foil 15m/min (0.1mm thick) 8m/min

Heat-affected zone <5μm <10μm

2. Breakthrough in industrial applicability

7×24 continuous operation:

Adopt optical glue-free design (anti-vibration>5G)

MTBF of key components>30,000 hours

Intelligent maintenance system:

Predictive maintenance reminder (based on AI algorithm)

Modular replacement (optical components<30 minutes)

3. Material processing advantages

High-reflective metal processing:

Copper welding depth-to-width ratio of 20:1 (conventional technology <10:1)

Gold foil cutting without melt beads (speed>20m/min)

Transparent material processing:

Glass internal modification quality control accuracy ±0.5μm

Sapphire cutting taper <0.1°

IV. Typische Anwendungsszenarien

1. New energy battery manufacturing

Pole-Ohr-Schnitt:

8μm copper foil cutting speed of 30m/min

Edge burr-free (Ra<0.5μm)

Battery shell welding:

Aluminum alloy welding penetration of 10mm

Porosity <0.01%

2. Aerospace

Turbine blade cooling hole:

High-temperature alloy micropores (Φ50μm depth-to-diameter ratio 50:1)

No recast layer (fatigue life increased by 3 times)

Composite material processing:

CFRP non-delamination cutting (heat-affected zone <3μm)

3. Precision electronics

Flexible circuit processing:

PI film cutting accuracy ±2μm

Minimum line width 15μm

Semiconductor packaging:

Glass through-hole (TGV) processing efficiency increased by 5 times

V. Technical comparison advantages

Comparison items Satsuma X US competitor German competitor

Power scalability 1.5kW design 800W upper limit 1kW upper limit

Pulse flexibility 0.1-10ps adjustable Fixed pulse width Limited adjustment

Footprint 1.2m² 2m² 1.8m²

Energy consumption ratio 1.0 1.3 1.2

VI. Service support system

Global application laboratories: France/USA/Japan/China (Shanghai)

Process development package: Provides 100+ material processing parameter libraries

Remote diagnosis: 5G network real-time troubleshooting

Satsuma X successfully solved the "thermal bottleneck" problem of ultrafast lasers in the high-power field through the deep integration of thin-film amplification technology and intelligent control, and became a transformative tool for strategic industries such as aerospace and new energy. Its modular design also reserves technical space for future upgrades to 1.5kW.