ASM die bonder AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates and is a key device in the automated die bond process
ASM die bonder AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates and is a key device in the automated die bond process
AD819 Series Fully Automatic ASMPT Die Bonding System
Features
●TO-can packaging processing capability
●Accuracy ± 15 µm @ 3s
●Eutectic die bond process (AD819-LD)
●Dispensing die bond process (AD819-PD)
Leverage Geekvalue ’s expertise and experience to elevate your brand to the next level.
Contact a sales expert
Reach out to our sales team to explore customized solutions that perfectly meet your business needs and address any questions you may have.
© All Rights Reserved. Technical Support:TiaoQingCMS
en
id
sk
srp
swe
it
pt
ben
may
bel
nl
fra
th
vie
ru
jp
kor
de
arm
aze
bos
bul
bur
cs
dan
div
el
est
fil
fin
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
kan
kin
lao
lav
lit
ltz
lug
mao
mlt
nep
nor
nya
ori
orm
per
pl
rom
san
som
spa
swa
tam
tr
ukr
urd
wel
xho